SK Hynix held a ceremonial groundbreaking on August 27, 2026, for a $4 billion advanced packaging facility at Purdue University in West Lafayette, Indiana, attended by Governor Mike Braun. CEO Kwak Noh-Jung stated the site will serve as a U.S. HBM production base by 2030 and projected no oversupply signals through the end of the decade. The company is leading the HBM market while conducting the majority of its $720 billion expansion in South Korea.